Weison Advanced Materials

Tungsten, Tungsten Alloy and Molybdenum Products

Copper Tungsten Plate

Copper Tungsten Plate

Physical Properties of Copper Tungsten Plate

PropertiesDensity
g/cm3
Thermal
Expansion
Coefficient
Heat
Conductivity
w/(m·k)
Thermal
Capacity
J/(kg°C)
Modulus of
Elasticity
GPa
Poisson DensityMelting Point °CStrength
MPa
Tungsten19.324.51741364110.283410550
Copper8.9316.64033851450.341083120

Properties of Copper Tungsten Plate

ItemChemical
composition
% --Cu
Chemical
composition
%-Impurity
Chemical
composition
%-W
DensityTRSResistivityElectric
Conductivity
Hardness
WCu5050±2.0≤0.5allowance11.9-12.3390≤3.2≥55115
WCu4040±2.0≤0.5allowance12.8-13.0480≤3.7≥47140
WCu3030±2.0≤0.5allowance13.8-14.4790≤4.1≥42175
WCu2020±2.0≤0.5allowance15.2-15.6980≤5.0≥34220
WCu1010±2.0≤0.5allowance16.8-17.21160≤6.5≥27260
WCu77±2.0≤0.5allowance17.3-17.81120≤7.0≥26275

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